Hitachi to sell partial stake in Hitachi Maxell
Hitachi, Ltd. has announced on 21 March that it would sell 7,800,000 shares (Proportion of all voting share: 14.76%) of…
Panasonic to release rice cooker with pressurized reheat feature
Panasonic will release steam and variable pressure IH rice cooker "SR-SPX7 series" on 1 June, with new pressurized reheat feature…
Toshiba Develops Natural LED Spotlight for Museums
Toshiba Lighting and Technology (TLT) has developed a small LED spotlight with built-in power supply for museum use. Traditionally museums are…
Ricoh Announces Voltage Regulator for IoT/Wearable Devices
Ricoh Electronic Devices has announced the "RP118 series" low-current voltage regulator IC designed for IoT/wearable devices. The RP118 series contributes…
Mitsubishi Electric releases discrete SiC-SBD device
Mitsubishi Electric has released their first discrete SiC-SBD (Silicon Carbide Schottky Barrier Diode) devices on 1 March. SiC-SBD and SiC-MOSFET…
Taiwan Maintains Lead of Wafer Capacity
According to the recently released Global Wafer Capacity report by IC Insights, Taiwan has maintained the lead of wafer capacity…
Toshiba to Spin-off its Memory Business as Toshiba Memory
Toshiba has announced the schedule and new company name for its memory business to be spun off. The decision of…
Torex Launches Hi-SAT COT DC/DC Regulators for FPGA/ASIC POL
Torex Semicondutor has launched the XC9273 series of DC/DC converter featuring its unique Hi-SAT COT (Constant On-Time) fast transient response…
ROHM releases Hi-Res audio SoC and industry-first reference platform
ROHM Semiconductor has announced the development of Hi-Res compatible audio SoC "BM94803AEKU", which integrates microcontroller, memory, decoder for various audio…
DISCO Corporation announces laser slicing technology for high-speed SiC wafer production
DISCO Corporation has announced it has developed an ingot laser slicing method called "KABRA" (Key Amorphous-Black Repetitive Absorption) for SiC…
Toshiba starts sampling single package SSD using 3D NAND “BiCS Flash”
Toshiba has started sampling "BG series with BiCS FLASH" with maximum capacity of 512GB to PC OEM. The SSD utilises…
SII Semiconductor releases serial EEPROM with top of class writing speed at 1.6V operation
SII Semiconductor, an associated company of Seiko Instruments, has released automotive serial EEPROM "S-93CxxCD0H series(105℃)" and "S-93AxxBD0A series (125℃)」". Both…
Panasonic to release air purifiers with newly developed ion device “Nanoe X”
Panasonic has announced two new humidifying air purifier models “F-VXM90” and “F-VXM70”, utilising its new charged water particle device “Nanoe…
Renesas to exit microwave device business
Renesas Electronics has announced that it will withdraw from the microwave semiconductor device business and focus its compound device business…
TDK’s EPCOS to accquire French sensor maker Tronics
TDK has announced the accquistion of French sensor maker "Tronics Microsystems" by its fully-own subsidiary EPCOS. EPCOS will launch an…