Showa Denko started shipping samples of 200mm SiC epi-wafers
Showa Denko is the first Japanese manufacturer to start shipping samples of 200mm (8 inch) SiC epitaxial wafer for power…
Industry
Sharp to double workforce of Kameyama plant for smartphone camera parts
According to Japanese media, Sharp plans to double workforce of its Kameyama plant in Mie Prefecture, Japan for new business.…
Nichicon to acquire part of power supply business of Murata
Nichicon has signed confirmation of intention with Murata on 5 Apr to transfer part of power supply business from Murata…
Sakai Display invested by Foxconn chairman losses 59.2 billion JPY in 2016
Sakai Display Products (SDP) posted losses of 59.2 billion JPY for the fiscal year ended Dec 2016, despite profit record…
Denso to build a new plant in Iwate, Japan
Denso announced its decision to build a new plant by Denso Iwate to enhance competitiveness of Denso Group and toward…
Hamamatsu Photonics completes new building for manufacturing optical semiconductors
Hamamatsu Photonics has announced the completion of the new building No.1 in Shingai factory. The Shingai factory, located in Hamamatsu,…
TDK to acquire sensor ASIC design company ICsense
TDK has announced the acquisition of ICsense from Belgium by TDK’s wholly-owned subsidiary TDK-Micronas GmbH on 28 March. ICsense will…
SII develops silicon based UV sensor for wearable devices and IoT
SII Semicondutor, a subsidiary of Seiko Instruments, together with the research team of Professor Shigetoshi Sugawa and Associate Professor Rihito…
Hitachi to sell partial stake in Hitachi Maxell
Hitachi, Ltd. has announced on 21 March that it would sell 7,800,000 shares (Proportion of all voting share: 14.76%) of…
Taiwan Maintains Lead of Wafer Capacity
According to the recently released Global Wafer Capacity report by IC Insights, Taiwan has maintained the lead of wafer capacity…
Toshiba to Spin-off its Memory Business as Toshiba Memory
Toshiba has announced the schedule and new company name for its memory business to be spun off. The decision of…
DISCO Corporation announces laser slicing technology for high-speed SiC wafer production
DISCO Corporation has announced it has developed an ingot laser slicing method called "KABRA" (Key Amorphous-Black Repetitive Absorption) for SiC…
Renesas to exit microwave device business
Renesas Electronics has announced that it will withdraw from the microwave semiconductor device business and focus its compound device business…
TDK’s EPCOS to accquire French sensor maker Tronics
TDK has announced the accquistion of French sensor maker "Tronics Microsystems" by its fully-own subsidiary EPCOS. EPCOS will launch an…
Sony to sell its battery business to Murata Manufacturing
Sony has announced the signing of memorandum of understanding (MoU) to transfer Sony Group's battery business to Murata Group, a…