Showa Denko is the first Japanese manufacturer to start shipping samples of 200mm (8 inch) SiC epitaxial wafer for power semiconductor.
Currently, SiC power semiconductors are mainly produced using 150 mm (6 inch) SiC epi-wafers. As the diameter of SiC epitaxial wafers increases, more chips can be obtained from a single wafer, which is expected to improve productivity and reduce costs for device manufacturers.