Taiwan Maintains Lead of Wafer Capacity
According to the recently released Global Wafer Capacity report by IC Insights, Taiwan has maintained the lead of wafer capacity…
Wafer
DISCO Corporation announces laser slicing technology for high-speed SiC wafer production
DISCO Corporation has announced it has developed an ingot laser slicing method called "KABRA" (Key Amorphous-Black Repetitive Absorption) for SiC…