According to the recently released Global Wafer Capacity report by IC Insights, Taiwan has maintained the lead of wafer capacity in the world while South Korea is narrowing the gap. Taiwan gained the title back in 2015 when it surpassed South Korea as the largest capacity holder. In 2016, only China and South Korea gained […]
DISCO Corporation has announced it has developed an ingot laser slicing method called “KABRA” (Key Amorphous-Black Repetitive Absorption) for SiC wafer which enables high-speed wafer production with reduced material loss. Compared with existing diamond wire saw process, the total processing time per ingot reduces from 2.5-3.5 days to 18 hours. Also, the number of wafers […]