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Tag: NAND

Industry

Toshiba to Spin-off its Memory Business as Toshiba Memory

Toshiba has announced the schedule and new company name for its memory business to be spun off. The decision of spinning off its memory business was announced on 27 Jan 2017 with new company name and schedule undecided. The new company name has now announced to be Toshiba Memory Corporation (Toshiba Memory). The new company […]

February 25, 2017February 28, 2017 EEinews Comment(0)
Components

Toshiba starts sampling single package SSD using 3D NAND “BiCS Flash”

Toshiba has started sampling “BG series with BiCS FLASH” with maximum capacity of 512GB to PC OEM. The SSD utilises latest 3-bit-per-cell (TLC) 3D NAND flash memory and the product lineup includes 128GB, 256GB and 512GB with M.2 1620 mounting type and M.2 2230 socket type. To fulfill power requirement of 2-in-1 slim mobile PC […]

August 5, 2016February 28, 2017 EEinews Comment(0)

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Denso to build a new plant in Iwate, Japan

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Taiwan Maintains Lead of Wafer Capacity

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Toshiba starts sampling single package SSD using 3D NAND “BiCS Flash”

August 5, 2016February 28, 2017 EEinews

Sharp to double workforce of Kameyama plant for smartphone camera parts

April 6, 2017April 6, 2017 EEinews

High-end rice cooker with charcoal pot, Mitsubishi Electric

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SII Semiconductor releases serial EEPROM with top of class writing speed at 1.6V operation

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About EEinews

EEinews is an online magazine focusing on the electronics industry from an Eastern perspective.

We aim to provide more insight on the development of the electronics industry in Japan, China and other countries from the east. You will find news, analysis as well as product reviews from this website.

Recent Posts

  • Panasonic to release household use HClO disinfection deodorizer
  • Sharp to double workforce of Kameyama plant for smartphone camera parts
  • Nichicon to acquire part of power supply business of Murata
  • Fostex to release Tokyo made bookshelf speaker GX100BJ

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