DISCO Corporation announces laser slicing technology for high-speed SiC wafer production

DISCO Corporation has announced it has developed an ingot laser slicing method called “KABRA” (Key Amorphous-Black Repetitive Absorption) for SiC wafer which enables high-speed wafer production with reduced material loss. Compared with existing diamond wire saw process, the total processing time per ingot reduces from 2.5-3.5 days to 18 hours. Also, the number of wafers […]