Hitachi, Ltd. has announced on 21 March that it would sell 7,800,000 shares (Proportion of all voting share: 14.76%) of Hitachi Maxell to SMBC Nikko Securities Inc. on 22 March 2017. After the transfer, Hitachi will retain 14.76% of all voting shares of Hitachi Maxell, which will no longer be an equity method affiliate of […]
Author: EEinews
Panasonic to release rice cooker with pressurized reheat feature
Panasonic will release steam and variable pressure IH rice cooker “SR-SPX7 series” on 1 June, with new pressurized reheat feature added along with existing steam and pressure in older “Double Dance Cooking” (W Odoritaki) models. The original “Double Dance Cooking” series rice cooker, released in 2013, was the first rice cooker to combine steam and […]
Toshiba Develops Natural LED Spotlight for Museums
Toshiba Lighting and Technology (TLT) has developed a small LED spotlight with built-in power supply for museum use. Traditionally museums are using halogen lamp and high-CRI fluorescent lamp for their high color reproduction, but their positions needed to be adjusted for each exhibition to adjust brightness. The new LED spotlight features Bluetooth for remote brightness control […]
Ricoh Announces Voltage Regulator for IoT/Wearable Devices
Ricoh Electronic Devices has announced the “RP118 series” low-current voltage regulator IC designed for IoT/wearable devices. The RP118 series contributes to low battery life with low current comsumption at 0.2uA when no load and 0.002uA in standby mode. It can also automatically switch from high-speed and low-power operation modes. The output current is 100mA and […]
Mitsubishi Electric releases discrete SiC-SBD device
Mitsubishi Electric has released their first discrete SiC-SBD (Silicon Carbide Schottky Barrier Diode) devices on 1 March. SiC-SBD and SiC-MOSFET has been used in Mitsubishi Electric’s power modules before, but this is their first discrete parts. They are available in two packages: TO-220 with model number BD20060T and TO-247 with model number BD20060S. Both models […]
Taiwan Maintains Lead of Wafer Capacity
According to the recently released Global Wafer Capacity report by IC Insights, Taiwan has maintained the lead of wafer capacity in the world while South Korea is narrowing the gap. Taiwan gained the title back in 2015 when it surpassed South Korea as the largest capacity holder. In 2016, only China and South Korea gained […]
Toshiba to Spin-off its Memory Business as Toshiba Memory
Toshiba has announced the schedule and new company name for its memory business to be spun off. The decision of spinning off its memory business was announced on 27 Jan 2017 with new company name and schedule undecided. The new company name has now announced to be Toshiba Memory Corporation (Toshiba Memory). The new company […]
Torex Launches Hi-SAT COT DC/DC Regulators for FPGA/ASIC POL
Torex Semicondutor has launched the XC9273 series of DC/DC converter featuring its unique Hi-SAT COT (Constant On-Time) fast transient response control. The XC9273 series is designed as point-of-load (POL) regulator for high load fluctuation FPGA and ASIC devices, providing fast transient response, low ripple and high efficiency. It supports input voltage from 2.7V to 5.5V […]
ROHM releases Hi-Res audio SoC and industry-first reference platform
ROHM Semiconductor has announced the development of Hi-Res compatible audio SoC “BM94803AEKU”, which integrates microcontroller, memory, decoder for various audio format with interfaces to CD, USB, SD, Bluetooth and PC (as an USB DAC). Existing solutions usually require external CD-DSP (for decoding CD) and SDRAM, this new audio SoC combines everything from I/O interface, audio […]
DISCO Corporation announces laser slicing technology for high-speed SiC wafer production
DISCO Corporation has announced it has developed an ingot laser slicing method called “KABRA” (Key Amorphous-Black Repetitive Absorption) for SiC wafer which enables high-speed wafer production with reduced material loss. Compared with existing diamond wire saw process, the total processing time per ingot reduces from 2.5-3.5 days to 18 hours. Also, the number of wafers […]
Toshiba starts sampling single package SSD using 3D NAND “BiCS Flash”
Toshiba has started sampling “BG series with BiCS FLASH” with maximum capacity of 512GB to PC OEM. The SSD utilises latest 3-bit-per-cell (TLC) 3D NAND flash memory and the product lineup includes 128GB, 256GB and 512GB with M.2 1620 mounting type and M.2 2230 socket type. To fulfill power requirement of 2-in-1 slim mobile PC […]
SII Semiconductor releases serial EEPROM with top of class writing speed at 1.6V operation
SII Semiconductor, an associated company of Seiko Instruments, has released automotive serial EEPROM “S-93CxxCD0H series(105℃)” and “S-93AxxBD0A series (125℃)」”. Both series feature top-of-class writing speed at 4ms while “S-93CxxCD0H series” also supports minimum opeating voltage at 1.6V. The IC is available in HSNT-8(2030)(2.0×3.0×t0.5 mm) package, which is ultra small in size while easy to mount. […]
Panasonic to release air purifiers with newly developed ion device “Nanoe X”
Panasonic has announced two new humidifying air purifier models “F-VXM90” and “F-VXM70”, utilising its new charged water particle device “Nanoe X” co-developed with Prof. Yoshio Higashiyama from Yamagata University. The original ion particle generator “Nanoe” was released on 2003 and largely utilised in public area and home appliance such as air conditioner and air purifier. […]
Renesas to exit microwave device business
Renesas Electronics has announced that it will withdraw from the microwave semiconductor device business and focus its compound device business on optoelectronics devices. Development of new microwave device has already been stopped, while production and supply are expected to be ended in 2018. According to Renesas, reasons of the withdrawal include peripheral components being incorporated […]
TDK’s EPCOS to accquire French sensor maker Tronics
TDK has announced the accquistion of French sensor maker “Tronics Microsystems” by its fully-own subsidiary EPCOS. EPCOS will launch an all-cash public tender offer for all publicly-held shares of Tronics for a price of EUR 13.20 per share, represents a 78.4% premium to the closing share price as of July 7, 2016. The total transaction […]